For those missing the significance, the 360 has an abnormally high failure rate. There are arguably multiple endemic problems, but part of the issue includes the original, larger /hotter 90nm chipset, and inefficient heatsinks. Some consoles returned from repair recently have included a secondary heat dissipation pipe added to the board.
But many in the industry have been waiting for these new chips. They're smaller, and they cost half as much to make (this may lead to further price cuts to the console this holiday to counter Sony's allegedly pending price reduction). Theoretically, the chips are also more economic with heat output. Consoles with the new chips also have simplified heatsinks.
How to tell if a console has the new chipset before buying it (and without the messiness of cracking it open and invalidating the warranty)?
"Check the barcode sticker on the side of the box. The 65nm chipped Halo 3 console was built August 24, 2007 from team "FDOU" and part of lot 734."
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